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Sizzix Accessory - Die Brush & Foam Pad for Wafer-Thin Dies


When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.

Do you need replacement parts? A set of Replacement Brush Heads and Foam Pad are available for purchase.

Product Dimensions
13.97cm x 4.45cm x 0.64cm - 11.43cm x 18.42cm
1 Die Brush, 1 Foam Pad